国家/地区 德国（32）
IPC部 H（32） B（16） C（12）
F（10） G（7）
IPC大类 H05（32）
IPC小类 H05K（21） H05B（12） H01L（11）
B32B（10） C01B（9） C23C（5）
H01B（4） B29C（3） B62D（3）
B82Y（3） C09D（3） F28F（3）
B05D（2） B60R（2） C08L（2）
IPC H05K007/20（7） H05K009/00（7） H05B003/14（6）
H05K003/46（5） B32B009/00（4） C01B032/182（4）
H01L023/373（4） B32B007/12（3） B32B015/04（3）
B82Y030/00（3） B82Y040/00（3） C01B031/02（3）
C01B031/04（3） C23C026/00（3） H01B013/00（3）
发明人 ATIAS B（4） LEVI A（4） MENTOVICH E（4）
NAVEH D（4） DELLOCK P K（3） AVOURIS P（2）
BENNAIM Y（2） DANINO S（2） ELIYA Y（2）
GARCIA A V（2） GLICKMAN D B（2） LIPP E（2）
MARTENS R I（2） ROTEM Y（2） SALTER S（2）
公开年 2022（8） 2021（7） 2013（5） 2012（3） 2018（2） 2020（2） 2023（2）
申请年 2020（6）  2022（6）  2021（5）  2010（3）  2012（3）  2013（3）  2019（2） 
专利权人 MELLANOX TEC.（4） UNIV BARILAN（4） FORD GLOBAL .（3） INT BUSINESS.（2）
PCB TECHNOLO.（2） TE CONNECTIV.（2） TYCO ELECTRO.（2）

Electronic component package, comprises polymeric core comprising first polymeric material and an outer overmold layer comprising second polymeric material containing graphene, outer overmold layer defining a case skin disposed on polymeric core,where first and second polymeric are thermoplastic.

NARITA M, SARANG S, KHAN S

Article e.g. rear window for motor vehicle comprises substrate and resistive heating element containing graphene, carbon nanostructure (CNS) material different from graphene, and glass frit, and graphene and CNS material containing adhesion promoter.

DELLOCK P K, KIZILTAS A, SALTER S, GLICKMAN D B, BOETTGER T F, BERTGE T F

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Method of depositing two-dimensional material onto target substrate, involves removing starting substrate layer from laminate stack after heat and pressure is applied to form target two-dimensional structure.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Vehicle electronic assembly housing, has housing portion formed from base material and overlaid with cladding material, and cover attached to housing portion, where cover is fixed with base material and cladding material.

SALTER S C, DELLOCK P K, HERMANN T, WINKEL T, SALTER S, HERRMANN T

Sensor, has temperature sensor for detecting internal temperature, and another temperature sensor detecting ambient temperature to adjust thermal conductivity of housing such that ratio of temperature to ambient temperature is obtained.

FEHRENBACH D, SUM S

Furniture structure for restaurant for eating food, has heatable and heat-radiating surface, and electric infrared heating device that is arranged on furniture in region of heatable and heat-radiating surface.

BALTACI H